Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride

The pitting corrosion of copper in borate buffer containing sodium chloride is studied by using potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The breakdown potential shifts towards more negative values as the sodium chloride concentration incr...

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Autores principales: Gennero de Chialvo, Maria Rosa, Salvarezza, Roberto Carlos, Vásquez Moll, Victor Dennis, Arvia, Alejandro Jorge
Formato: Articulo
Lenguaje:Inglés
Publicado: 1985
Materias:
Ciencias Exactas
Química
Cinética química
Corrosión
Cloruro de Sodio
Electrón
pitting corrosion
Cobre
Acceso en línea:http://sedici.unlp.edu.ar/handle/10915/79490
Aporte de:
SEDICI (UNLP) de Universidad Nacional de La Plata
id I19-R120-10915-79490
record_format dspace
institution Universidad Nacional de La Plata
institution_str I-19
repository_str R-120
collection SEDICI (UNLP)
language Inglés
topic Ciencias Exactas
Química
Cinética química
Corrosión
Cloruro de Sodio
Electrón
pitting corrosion
Cobre
spellingShingle Ciencias Exactas
Química
Cinética química
Corrosión
Cloruro de Sodio
Electrón
pitting corrosion
Cobre
Gennero de Chialvo, Maria Rosa
Salvarezza, Roberto Carlos
Vásquez Moll, Victor Dennis
Arvia, Alejandro Jorge
Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
topic_facet Ciencias Exactas
Química
Cinética química
Corrosión
Cloruro de Sodio
Electrón
pitting corrosion
Cobre
description The pitting corrosion of copper in borate buffer containing sodium chloride is studied by using potentiostatic and potentiodynamic techniques complemented with scanning electron microscopy and EDAX. The breakdown potential shifts towards more negative values as the sodium chloride concentration increases. During pitting both soluble Cu(I) and Cu(II) species are detected. The first stage of pitting is explained through the competition between the passive layer formation and the nucleation and growth of the CuCl layer in equilibrium with Cu(I)-chloride complexes in solution. When salt nuclei reach the metal surface, pit growth under charge-transfer control is found. In the following stage the kinetics of pit growth changes to a diffusion controlled process when the thick CuCl layer is completed. Secondary breakdown of the salt layer results in copper dissolution through Cu(II) soluble species. The corresponding overall process is discussed in terms of a sum of nucleation and growth processes. The reaction model reproduces the potentiostatic current transients of copper in weakly alkaline borate buffer containing sodium chloride.
format Articulo
Articulo
author Gennero de Chialvo, Maria Rosa
Salvarezza, Roberto Carlos
Vásquez Moll, Victor Dennis
Arvia, Alejandro Jorge
author_facet Gennero de Chialvo, Maria Rosa
Salvarezza, Roberto Carlos
Vásquez Moll, Victor Dennis
Arvia, Alejandro Jorge
author_sort Gennero de Chialvo, Maria Rosa
title Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
title_short Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
title_full Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
title_fullStr Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
title_full_unstemmed Kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
title_sort kinetics of passivation and pitting corrosion of polycrystalline copper in borate buffer solutions containing sodium chloride
publishDate 1985
url http://sedici.unlp.edu.ar/handle/10915/79490
work_keys_str_mv AT gennerodechialvomariarosa kineticsofpassivationandpittingcorrosionofpolycrystallinecopperinboratebuffersolutionscontainingsodiumchloride
AT salvarezzarobertocarlos kineticsofpassivationandpittingcorrosionofpolycrystallinecopperinboratebuffersolutionscontainingsodiumchloride
AT vasquezmollvictordennis kineticsofpassivationandpittingcorrosionofpolycrystallinecopperinboratebuffersolutionscontainingsodiumchloride
AT arviaalejandrojorge kineticsofpassivationandpittingcorrosionofpolycrystallinecopperinboratebuffersolutionscontainingsodiumchloride
bdutipo_str Repositorios
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