Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol

Deposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing small amounts of benzyl alcohol was investigated. Polarisation experiments (cylic and linear sweep voltammetry) were carried out using a rotating disc electrode to identify the reduction and dissolution processes that take...

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Detalles Bibliográficos
Autores principales: Bengoa, Leandro Nicolás, Pary, Paola, Conconi, María Susana, Egli, Walter Alfredo
Formato: Articulo
Lenguaje:Inglés
Publicado: 2017
Materias:
Tin
Acceso en línea:http://sedici.unlp.edu.ar/handle/10915/126756
Aporte de:
id I19-R120-10915-126756
record_format dspace
institution Universidad Nacional de La Plata
institution_str I-19
repository_str R-120
collection SEDICI (UNLP)
language Inglés
topic Química
Copper
Tin
Electrodeposition
Methanesulfonic acid
Cyanide-free
spellingShingle Química
Copper
Tin
Electrodeposition
Methanesulfonic acid
Cyanide-free
Bengoa, Leandro Nicolás
Pary, Paola
Conconi, María Susana
Egli, Walter Alfredo
Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol
topic_facet Química
Copper
Tin
Electrodeposition
Methanesulfonic acid
Cyanide-free
description Deposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing small amounts of benzyl alcohol was investigated. Polarisation experiments (cylic and linear sweep voltammetry) were carried out using a rotating disc electrode to identify the reduction and dissolution processes that take place in the system and to determine the effect of the solution constituents on them. Potentiostatic deposition was performed onto a rotating cylinder electrode and the resulting deposits were charactised using SEM and XRD. The results showed that co-deposition of copper and tin is possible even at potentials less cathodic than tin discharge potential. The latter was attributed to the underpotential deposition of Sn2+ on a copper substrate. Smooth and compact deposits were obtained at various deposition potentials and Cu2+ concentrations, with Sn contents between 1.6 - 62.4 wt.%. Several stable phases, such as pure copper, a-CuSn, e-Cu3Sn and h0-Cu6Sn5 phase, were detected at different operating conditions. Finally, it was found that BA increases the amount of tin in the deposit when Cu2+ concentrations in the solution is kept low, especially at high overpotentials. This additive also inhibits the formation of dendrites and reduces surface roughness.
format Articulo
Articulo
author Bengoa, Leandro Nicolás
Pary, Paola
Conconi, María Susana
Egli, Walter Alfredo
author_facet Bengoa, Leandro Nicolás
Pary, Paola
Conconi, María Susana
Egli, Walter Alfredo
author_sort Bengoa, Leandro Nicolás
title Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol
title_short Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol
title_full Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol
title_fullStr Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol
title_full_unstemmed Electrodeposition of Cu-Sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol
title_sort electrodeposition of cu-sn alloys from a methanesulfonic acid electrolyte containing benzyl alcohol
publishDate 2017
url http://sedici.unlp.edu.ar/handle/10915/126756
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AT conconimariasusana electrodepositionofcusnalloysfromamethanesulfonicacidelectrolytecontainingbenzylalcohol
AT egliwalteralfredo electrodepositionofcusnalloysfromamethanesulfonicacidelectrolytecontainingbenzylalcohol
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