Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions

The dynamics of Cu surfaces immersed in either aqueous HClO<sub>4</sub> or H<sub>2</sub>SO<sub>4</sub> solution under galvanostatic conditions at room temperature was studied by in situ scanning tunneling microscopy (STM) sequential imaging. The mobile interface d...

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Autores principales: Vela, María Elena, Andreasen, Gustavo, Aziz, S. G., Salvarezza, Roberto Carlos, Arvia, Alejandro Jorge
Formato: Articulo
Lenguaje:Inglés
Publicado: 1998
Materias:
Acceso en línea:http://sedici.unlp.edu.ar/handle/10915/126571
https://www.sciencedirect.com/science/article/abs/pii/S0013468697002223
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id I19-R120-10915-126571
record_format dspace
institution Universidad Nacional de La Plata
institution_str I-19
repository_str R-120
collection SEDICI (UNLP)
language Inglés
topic Ciencias Exactas
Química
scanning tunneling microscopy
electrodissolving copper
spellingShingle Ciencias Exactas
Química
scanning tunneling microscopy
electrodissolving copper
Vela, María Elena
Andreasen, Gustavo
Aziz, S. G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
topic_facet Ciencias Exactas
Química
scanning tunneling microscopy
electrodissolving copper
description The dynamics of Cu surfaces immersed in either aqueous HClO<sub>4</sub> or H<sub>2</sub>SO<sub>4</sub> solution under galvanostatic conditions at room temperature was studied by in situ scanning tunneling microscopy (STM) sequential imaging. The mobile interface depends considerably on the apparent current density (j) applied to the specimen. At j = 0, the Cu topography turns out to be highly dynamic as mass transport among different domains takes place. Conversely, for j = 6 μA cm<sup>−2</sup> an inhomogeneous attack of the Cu surface leading to a remarkable increase in roughness and to the formation of etched pits at certain surface domains can be observed. Etched pit domains drive the mobile interface to an unstable regime. The addition of HCl to those acid solutions to reach concentrations higher than 10<sup>−2</sup> M leads to the formation of a Cu<sub>2</sub>Cl<sub>2</sub> layer.
format Articulo
Articulo
author Vela, María Elena
Andreasen, Gustavo
Aziz, S. G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_facet Vela, María Elena
Andreasen, Gustavo
Aziz, S. G.
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_sort Vela, María Elena
title Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
title_short Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
title_full Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
title_fullStr Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
title_full_unstemmed Sequential <i>in situ</i> STM imaging of electrodissolving copper in different aqueous acid solutions
title_sort sequential <i>in situ</i> stm imaging of electrodissolving copper in different aqueous acid solutions
publishDate 1998
url http://sedici.unlp.edu.ar/handle/10915/126571
https://www.sciencedirect.com/science/article/abs/pii/S0013468697002223
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