Early stages of copper electrodeposition on columnar structured platinum electrodes

The electrodeposition of Cu from diluted CuSO<sub>4</sub> in 0.5 M H<sub>2</sub>SO<sub>4</sub> on columnar structured Pt electrodes was studied through voltammetry. For a constant set of experimental conditions, as the Pt electrode roughness is increased, bulk Cu...

Descripción completa

Guardado en:
Detalles Bibliográficos
Autores principales: Martins, María Elisa, Salvarezza, Roberto Carlos, Arvia, Alejandro Jorge
Formato: Articulo
Lenguaje:Inglés
Publicado: 1992
Materias:
Ciencias Exactas
Química
Electrocrystallization
Metal electrodeposition
Electrode roughness
Growth models
Columnar structured metal electrodes
Acceso en línea:http://sedici.unlp.edu.ar/handle/10915/119362
Aporte de:
SEDICI (UNLP) de Universidad Nacional de La Plata
id I19-R120-10915-119362
record_format dspace
institution Universidad Nacional de La Plata
institution_str I-19
repository_str R-120
collection SEDICI (UNLP)
language Inglés
topic Ciencias Exactas
Química
Electrocrystallization
Metal electrodeposition
Electrode roughness
Growth models
Columnar structured metal electrodes
spellingShingle Ciencias Exactas
Química
Electrocrystallization
Metal electrodeposition
Electrode roughness
Growth models
Columnar structured metal electrodes
Martins, María Elisa
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
Early stages of copper electrodeposition on columnar structured platinum electrodes
topic_facet Ciencias Exactas
Química
Electrocrystallization
Metal electrodeposition
Electrode roughness
Growth models
Columnar structured metal electrodes
description The electrodeposition of Cu from diluted CuSO<sub>4</sub> in 0.5 M H<sub>2</sub>SO<sub>4</sub> on columnar structured Pt electrodes was studied through voltammetry. For a constant set of experimental conditions, as the Pt electrode roughness is increased, bulk Cu electrodeposition tends to disappear, the amount of electro-adsorbed H atoms increases, and the coverage of Pt by 2-D Cu domains decreases. This means that under non-equilibrium conditions for diluted Cu<sup>2+</sup>-ion-containing solutions and highly rough Pt substrates, 3-D Cu nuclei, and 2-D Cu and free Pt domains are simultaneously present at the initial stages of the process. In these cases, bulk Cu can be detected when the degree of Pt surface coverage by Cu atoms exceeds 0.5.
format Articulo
Articulo
author Martins, María Elisa
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_facet Martins, María Elisa
Salvarezza, Roberto Carlos
Arvia, Alejandro Jorge
author_sort Martins, María Elisa
title Early stages of copper electrodeposition on columnar structured platinum electrodes
title_short Early stages of copper electrodeposition on columnar structured platinum electrodes
title_full Early stages of copper electrodeposition on columnar structured platinum electrodes
title_fullStr Early stages of copper electrodeposition on columnar structured platinum electrodes
title_full_unstemmed Early stages of copper electrodeposition on columnar structured platinum electrodes
title_sort early stages of copper electrodeposition on columnar structured platinum electrodes
publishDate 1992
url http://sedici.unlp.edu.ar/handle/10915/119362
work_keys_str_mv AT martinsmariaelisa earlystagesofcopperelectrodepositiononcolumnarstructuredplatinumelectrodes
AT salvarezzarobertocarlos earlystagesofcopperelectrodepositiononcolumnarstructuredplatinumelectrodes
AT arviaalejandrojorge earlystagesofcopperelectrodepositiononcolumnarstructuredplatinumelectrodes
bdutipo_str Repositorios
_version_ 1764820448299712512

Ejemplares similares