Feature Profile Evolution in Plasma Processing Using On-wafer Monitoring System
This book provides for the first time a good understanding of the etching profile technologies that do not disturb the plasma. Three types of sensors are introduced: on-wafer UV sensors, on-wafer charge-up sensors and on-wafer sheath-shape sensors in the plasma processing and prediction system of re...
Guardado en:
| Autor principal: | |
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| Formato: | Libro electrónico |
| Lenguaje: | Inglés |
| Publicado: |
Tokyo :
Springer Japan : Imprint: Springer,
2014.
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| Colección: | SpringerBriefs in Applied Sciences and Technology,
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| Materias: | |
| Acceso en línea: | http://dx.doi.org/10.1007/978-4-431-54795-2 |
| Aporte de: | Registro referencial: Solicitar el recurso aquí |
Tabla de Contenidos:
- Introduction
- On-wafer UV sensor and prediction of UV irradiation damage
- Prediction of Abnormal Etching Profiles in High-aspect-ratio Via/Hole Etching Using On-wafer Monitoring System
- Feature Profile Evolution in Plasma Processing Using Wireless On-wafer Monitoring System.