Cita APA (7a ed.)

Noia, B., & Chakrabarty, K. (2014). Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs. Springer International Publishing : Imprint: Springer.

Cita Chicago Style (17a ed.)

Noia, Brandon, y Krishnendu Chakrabarty. Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs. Cham: Springer International Publishing : Imprint: Springer, 2014.

Cita MLA (8a ed.)

Noia, Brandon, y Krishnendu Chakrabarty. Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs. Springer International Publishing : Imprint: Springer, 2014.